CVE detail
CVE-2022-22071: Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Source: CISA Known Exploited Vulnerabilities catalog · back to feed
Vendor / product
Qualcomm · Multiple Chipsets
- Date added (KEV)
- Dec 05, 2023
- CISA due date
- Dec 26, 2023
- Ransomware campaign use
- Unknown
Required action
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Vendor fix: Vendor patch
Scorifya interpretation
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Plain English
Technical detail
From CISA
Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.
This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.4/-/commit/586840fde350d7b8563df9889c8ce397e2c20dda; https://nvd.nist.gov/vuln/detail/CVE-2022-22071
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SOC 2 compliance
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- https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletinPatchVendor Advisory
- https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletinPatchVendor Advisory
- https://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2022-22071US Government Resource
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- CVE-2025-27038Multiple Chipsets, Qualcomm Multiple Chipsets Use-After-Free Vulnerability
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